ICPF Shenzhen 2026 — IC Packaging & Semiconductor Test Fair
Showcases advanced equipment and materials for semiconductor IC packaging and testing — die bonders, chip bonders, wire bonders, molding machines, vacuum coating and lithography. One-stop solutions for the entire packaging chain.
When and where will ICPF Shenzhen 2026 — IC Packaging & Semiconductor Test Fair take place?
Showcases advanced equipment and materials for semiconductor IC packaging and testing — die bonders, chip bonders, wire bonders, molding machines, vacuum coating and lithography. One-stop solutions for the entire packaging chain.
ICPF Shenzhen 2026 — IC Packaging & Semiconductor Test Fair is an international packaging, plastics & rubber trade fair held in Shenzhen, China. The next edition takes place on 27-29 October 2026.
The event focuses on the packaging, plastics & rubber industry, bringing together exhibitors, manufacturers, distributors and trade visitors from around the world.
The fair is organized by NEPCON Asia / RX Tradex. Visit https://www.nepconasia.com/en-gb/bandaoti/ic-pack.html for detailed exhibitor and visitor information.
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Shenzhen Travel Guide
Shenzhen Convention Center
Futian bölgesinin merkezi fuar mekanı, metro ile kolay erişim.
Window of the World
130 dünya yapısının minyatür replikalarıyla tema park.
Huaqiangbei Elektronik Pazarı
Dünyanın en büyük elektronik toptan pazarı.
Splendid China Folk Village
Çin'in 56 etnik grubunun geleneksel köyleri ve performansları.
OCT-LOFT Yaratıcı Park
Eski fabrika bölgesinden dönüştürülmüş sanat ve tasarım merkezi.
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