Yearly

IC & SENSOR PACKAGING EXPO JAPAN - TOKYO

Name: IC & SENSOR PACKAGING EXPO JAPAN - TOKYO
Start: 2027-02-17
End: 2027-02-19
Location: Tokyo International Exhibition Center (Tokyo Big Sight)

TOKYO 2027 - Asia's Leading IC End Manufacturing Exhibition bringing together Advanced Equipment, Materials and Services. Assembly Equipment for IC Packaging, Packaging Materials / Equipment, Analysis / Simulation Software...

17-19 February 2027

General

Tokyo International Exhibition Center (Tokyo Big Sight)

Tokyo, Japan

JapanTokyoIC & SENSOR PACKAGING EXPO JAPAN - TOKYO

When and where will IC & SENSOR PACKAGING EXPO JAPAN - TOKYO take place?

Download fair details

Click to download the details of IC & SENSOR PACKAGING EXPO JAPAN - TOKYO as PDF

▼ Tags

#Fair#Trade#Export#B2B#Networking